In the lead-free solder lead-free, and the melting point than the traditional (63% Sn + 37% Pb) solder high.
Commonly used lead-free solder:
"Sn-Ag (Sn + Ag, 96-98% tin)
"Sn-Cu (tin and copper, 96% tin)
"Sn-Ag-Cu (Sn + Ag + Cu, 93-96% Sn)
"Sn-Ag-Bi (Ag + Sn + Bi, 90.5-94% tin)
"Sn-Ag-Bi-Cu (Ag + Sn + Bi + Cu, 90-94% Sn)
63/37 lead solder melting point of 183 ℃, freezing point the same as the 183 ℃. Note: This does not appear Solder colloidal [same cooling from liquid to solid (or vice versa) temperature points].
60/40 lead solder melting point of 191 ℃, the freezing point of 183 ℃. Note: This solder has a range of 8 ℃ form a colloidal [cooling from liquid to solid (or vice versa) the desired temperature range].
Lead-free solder melting point range from 217 ℃ to 226 ℃.
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